Metal composites and laminates formed therefrom

Details Metal composites and laminates formed therefrom Metal composites and laminates formed therefrom

1980-08-15

1982-04-06

Gantz, Delbert E.

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

204 33, 428652, 428674, B32B 1508, B32B 1520

Patent

active

043236324

ABSTRACT:
A metal composite comprising a substrate having a uniformly, mildly etched surface of an aluminum alloy, e.g. an alloy, consisting of at least about 99 wt. % aluminum, and the balance comprising specified quantities of silicon, iron, copper, manganese and zinc, and a uniformly adhering, electrocathodically deposited copper foil. The resulting peel strength between the aluminum alloy surface and the copper foil, after lamination of the composite to a resinous substrate under heat and pressure is within the range of from about 6 to about 8 lbs./in. of width of copper foil. This can be reduced to a value within the range of about 0.3 to about 2 lbs./in. of width by overplating the copper foil with a layer of zinc or indium. The resinous substrate may be a glass fiber reinforced epoxy resin, such as is used in the manufacture of printed circuit boards.

REFERENCES:
patent: 2871171 (1959-01-01), Atkinson
patent: 3775265 (1973-11-01), Bharucha et al.
patent: 3857681 (1974-12-01), Yates et al.
patent: 3998601 (1976-12-01), Yates et al.
Alloy Digest, Aluminum 1100 Filing Code: Al-44, Oct. 1956, Published by Engineering Alloys Digest, Inc., Upper Montclair, New Jersey.

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