Metal CMP slurry compositions that favor mechanical removal...

Abrading – Abrading process – Glass or stone abrading

Reexamination Certificate

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C451S036000, C451S028000, C438S692000, C438S693000, C252S079100, C156S345110

Reexamination Certificate

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06953389

ABSTRACT:
Metal CMP slurry compositions having relatively low chemical etch rate and relatively high mechanical polishing rate characteristics are provided. The relatively high mechanical polishing rate characteristics are achieved using relatively high concentrations of mechanical abrasive (e.g., ≧8 wt %) in combination with sufficient quantities of a wetting agent to inhibit micro-scratching of underlying surfaces (e.g., insulating layers, conductive vias, . . . ) being polished. The slurry compositions also include a highly stable metal-propylenediaminetetraacetate (M-PDTA) complex, which may operate to inhibit metal-oxide re-adhesion on the metal surface being polished and/or inhibit oxidation of the metal surface by chelating with the surface.

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