Metal-clad laminates

Details Metal-clad laminates Metal-clad laminates

1974-02-08

1976-10-05

Ansher, Harold

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Physical dimension specified

156150, 156151, 156233, 156246, 156272, 204 35R, 428209, 428210, 428418, 428457, 428901, C25D 556, C25D 500

Patent

active

039845982

ABSTRACT:
Metal-clad laminates in which the metal coating of the laminate is only from about 1 micron to about 20 microns in thickness are prepared by depositing a copper coating on a substrate which has been treated with a release agent, treating the upper side of the metal layer to improve the adhesive properties of the metal, thereafter bonding the metal coating to a laminate and removing the substrate to thus prepare the desired metal-clad laminate.

REFERENCES:
patent: 2666008 (1954-01-01), Enslein
patent: 2874085 (1959-02-01), Brietzke
patent: 3088847 (1963-05-01), Pines
patent: 3220897 (1965-11-01), Conley
patent: 3235395 (1966-02-01), Scharf
patent: 3324014 (1967-06-01), Modjeska
patent: 3340121 (1967-09-01), Lawrenz
patent: 3393117 (1968-07-01), Zolg
patent: 3434889 (1969-03-01), Haroldson
patent: 3506507 (1970-04-01), Brietzke
patent: 3532587 (1970-10-01), Ungar
patent: 3644166 (1972-02-01), Gause
patent: 3741858 (1973-06-01), Fujiwara
patent: 3753850 (1973-08-01), Brunet

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