Metal-clad laminate construction

Details Metal-clad laminate construction Metal-clad laminate construction

1983-11-07

1985-02-12

Herbert, Thomas J.

Stock material or miscellaneous articles

Composite

Of silicon containing

427 96, 427 99, 427123, 4271263, 427217, 427380, 428450, 428469, 428901, B32B 904, B05D 512

Patent

active

044991525

ABSTRACT:
A metal-clad laminate having special utility in the production of high resolution printed circuit patterns and preparation of the laminate are described. The laminate preferably comprises a resin-bonded, glass-reinforced substrate, a layer of coupling agent covering and bonded to a major surface of the substrate, a layer of ultra-thin copper adjacent the layer of coupling agent, and a composite bonding layer disposed between the copper layer and the layer of coupling agent. The composite bonding layer comprises copper alloyed with at least one non-copper metal and oxide material of the non-copper metal.

REFERENCES:
patent: 3984598 (1976-10-01), Sarazin et al.
patent: 4364731 (1982-12-01), Norling et al.
patent: 4383003 (1983-05-01), Lifshin et al.

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