Metal-clad laminate adapted for printed circuits

Details Metal-clad laminate adapted for printed circuits Metal-clad laminate adapted for printed circuits

1984-04-13

1985-10-15

Herbert, Thomas J.

Coating processes

With post-treatment of coating or coating material

Heating or drying

1563075, 4273761, 4273855, 427386, 4273899, 427402, 428415, 428901, B05D 302, B32B 1506

Patent

active

045474087

ABSTRACT:
A metallized, laminated substrate well adapted for the production of printed circuits is comprised of:

REFERENCES:
patent: 4110147 (1978-08-01), Grunwald et al.
patent: 4314002 (1982-02-01), Oizumi et al.

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