Metal-ceramic joint

Details Metal-ceramic joint Metal-ceramic joint

1992-04-03

1995-02-07

Beck, Shrive

Coating processes

Immersion or partial immersion

Inorganic base

427437, 4274431, 205182, 205263, 205271, 205291, B05D 100, C25D 700

Patent

active

053874412

ABSTRACT:
A process is described for electrolessly depositing or electrodepositing a solder layer composed of copper and silver and having an overall composition of silver/copper of from 75:25 to 70:30 and a total layer thickness of 15 to 100 .mu.m on a metallized ceramic. In this process, copper layers and silver layers are deposited alternately on the metallized ceramic. The number of layers is at least 3 and the individual layer thickness is 5 to 10 .mu.m.

REFERENCES:
patent: 2924535 (1960-02-01), Schaefer
patent: 4192686 (1980-03-01), Soltys
patent: 4996111 (1991-02-01), Do-Thoi
patent: 5156322 (1992-10-01), Do-Thoi
Derwent Publications Ltd., London, GB; Class L02, AN 82-12819E and JP-A-57 003 773 (Hitachi KK) published Jan. 9, 1982.

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