Metal-ceramic composite substrate

Details Metal-ceramic composite substrate Metal-ceramic composite substrate

1997-07-23

2000-06-06

Krynski, William

Stock material or miscellaneous articles

Structurally defined web or sheet

Continuous and nonuniform or irregular surface on layer or...

428469, 428698, 428702, 4283122, 428632, 428627, 428612, 428174, D06N 704

Patent

active

060715928

ABSTRACT:
A metal-ceramic composite circuit substrate having a ceramic substrate and a metal plate joined to at least one main surface of the ceramic substrate, the rate of voids formed on at least a joint surface at a semiconductor mounting portion of the metal plate per unit surface area being not more than 1.49%. The diameter of void formed on at least the joint surface at a semiconductor mounting portion of the metal plate is not larger than 0.7 mm. The surface undulation of the ceramic substrate is not more than 15 .mu.m/20 mm measured by a surface roughness tester in case that the ceramic substrate is joined directly to the metal plate. The metal plate is joined to the ceramic substrate through a brazing material containing at least one active metal selected from a group consisting of Ti, Zr, Hf and Nb. The ceramic substrate is at least one kind of ceramic substrate selected from a group consisting of Al.sub.2 O.sub.3, AlN, BeO, SiC, Si.sub.3 N.sub.4 and ZrO.sub.2.

REFERENCES:
patent: 4409278 (1983-10-01), Jochym
patent: 4591535 (1986-05-01), Mizuhara
patent: 4630767 (1986-12-01), Mizuhara
patent: 4678720 (1987-07-01), Hsu et al.
patent: 4698271 (1987-10-01), Moorhead
patent: 4811893 (1989-03-01), Kanahara et al.
patent: 4959507 (1990-09-01), TanaKa et al.
patent: 5153077 (1992-10-01), Kashiba et al.
patent: 5403672 (1995-04-01), Urasaki et al.
patent: 5465898 (1995-11-01), Schulz-Harder et al.
patent: 5525432 (1996-06-01), Do-Thoi et al.
patent: 5585672 (1996-12-01), Koike et al.
patent: 5622769 (1997-04-01), Kozuka et al.
patent: 5672848 (1997-09-01), Komorita et al.
Patent Abstracts of Japan, vol. 095, No. 009, Oct. 1995 & JP 07 162105, Jun. 1995.
Patent Abstracts of Japan, vol. 095, No. 006, Jul. 1995 & JP 07 066507, Mar. 1995.
Patent Abstracts of Japan, vol. 014, No. 239, May 1990 & JP 02 065263, Mar. 1990.

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