Metal-ceramic circuit board

Details Metal-ceramic circuit board Metal-ceramic circuit board

2001-05-03

2008-03-25

Dinh, Tuan T. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S252000, C174S255000

Reexamination Certificate

active

07348493

ABSTRACT:
A metal-ceramic circuit board is characterized by being constituted by bonding directly on a base plate of aluminum or aluminum alloy at least one of ceramic substrate boards having a conductive metal member of an electronic circuit. The base plate has a proof stress not higher than 320 (MPa) and a thickness not smaller than 1 mm.

REFERENCES:
patent: 3852877 (1974-12-01), Ahn et al.
patent: 3994430 (1976-11-01), Cusano et al.
patent: 4284437 (1981-08-01), Baba et al.
patent: 4531044 (1985-07-01), Chang
patent: 4592781 (1986-06-01), Cheney et al.
patent: 4762553 (1988-08-01), Savage et al.
patent: 4901137 (1990-02-01), Sato et al.
patent: 4906812 (1990-03-01), Nied et al.
patent: 4962291 (1990-10-01), Fujita et al.
patent: 4987677 (1991-01-01), Tanaka et al.
patent: 5650662 (1997-07-01), Edwards et al.
patent: 5672848 (1997-09-01), Komorita et al.
patent: 5707715 (1998-01-01), deRochemont et al.
patent: 5767576 (1998-06-01), Kobayashi et al.
patent: 5965193 (1999-10-01), Ning et al.
patent: 6033787 (2000-03-01), Nagase et al.
patent: 6040039 (2000-03-01), Ikeda et al.
patent: 6110297 (2000-08-01), Hayashi et al.
patent: 6123895 (2000-09-01), Yamagata et al.
patent: 6175084 (2001-01-01), Saitoh et al.
patent: 6197435 (2001-03-01), Tsujimura et al.
patent: 6373717 (2002-04-01), Downes et al.
patent: 6938333 (2005-09-01), Osanai et al.
patent: 0676800 (1995-10-01), None
patent: 0788153 (1997-08-01), None
patent: 0827198 (1998-03-01), None
patent: 11226717 (1999-08-01), None
patent: 118588/89 (1992-07-01), None
patent: 147411/88 (1997-02-01), None
patent: 11226717 (1999-08-01), None
Special Metals, MIMONIC Alloy 91.
Restriction Requirement, U.S. Appl. No. 10/242,022; Mail date: Mar. 12, 2004.
Office Action, U.S. Appl. No. 10/242,022; Mail date: Jun. 2, 2004.
Notice of Allowance, U.S. Appl. No. 10/242,022; Mail date: Nov. 29, 2004.
Notice of Allowance, U.S. Appl. No. 10/242,022; Mail date: Mar. 31, 2005.
Special Metals Corporation, Nimonic® alloy 91, pp. 1-8, Apr. 2004.
Office Action, U.S. Appl. No. 11/066,912; Mail date: Dec. 12, 2005.
Restriction Requirement, U.S. Appl. No. 11/066,912; Mail date: Oct. 17, 2005.

Affiliated with

Also associated with

Rating

Metal-ceramic circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metal-ceramic circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metal-ceramic circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3980034