Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2007-08-14
2007-08-14
Reichard, Dean A. (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S255000, C361S704000, C361S720000, C361S705000, C428S210000, C428S545000, C428S615000, C257S753000, C257S706000
Reexamination Certificate
active
10747837
ABSTRACT:
There is provided a metal/ceramic bonding substrate capable of preventing the reverse thereof from greatly warping so as to be concave even if it is heated for soldering. In the metal/ceramic bonding substrate, a metal circuit plate12is bonded to one side of a ceramic substrate10, and a heat sink plate (metal base plate)14is bonded to the other side thereof. On the heat sink plate14, a work-hardened layer16is formed by shot peening. On the metal circuit plate12of the metal/ceramic bonding substrate, semiconductor chips (Si chips)18are soldered (solder layer20). Then, a power module is produced by a predetermined process. On the reverse (the side of the work-hardened layer16) of the power module, a radiating fin26is mounted via a thermal grease24by means of screws22or the like.
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Ibaraki Susumu
Iyoda Ken
Namioka Makoto
Osanai Hideyo
Bachman & LaPointe P.C.
Dowa Mining Co. Ltd.
Nguyen Hoa C.
Reichard Dean A.
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