Metal/ceramic bonding substrate and method for producing same

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C174S255000, C361S704000, C361S720000, C361S705000, C428S210000, C428S545000, C428S615000, C257S753000, C257S706000

Reexamination Certificate

active

10747837

ABSTRACT:
There is provided a metal/ceramic bonding substrate capable of preventing the reverse thereof from greatly warping so as to be concave even if it is heated for soldering. In the metal/ceramic bonding substrate, a metal circuit plate12is bonded to one side of a ceramic substrate10, and a heat sink plate (metal base plate)14is bonded to the other side thereof. On the heat sink plate14, a work-hardened layer16is formed by shot peening. On the metal circuit plate12of the metal/ceramic bonding substrate, semiconductor chips (Si chips)18are soldered (solder layer20). Then, a power module is produced by a predetermined process. On the reverse (the side of the work-hardened layer16) of the power module, a radiating fin26is mounted via a thermal grease24by means of screws22or the like.

REFERENCES:
patent: 3199000 (1965-08-01), Nippert
patent: 4700273 (1987-10-01), Kaufman
patent: 4788765 (1988-12-01), Kaufman et al.
patent: 4914551 (1990-04-01), Anschel et al.
patent: 5526867 (1996-06-01), Keck et al.
patent: 6033787 (2000-03-01), Nagase et al.
patent: 6123895 (2000-09-01), Yamagata et al.
patent: 6310775 (2001-10-01), Nagatomo et al.
patent: 6426154 (2002-07-01), Naba et al.
patent: 6938333 (2005-09-01), Osanai et al.
patent: 2002/0125563 (2002-09-01), Scheuermann
patent: 2003/0219576 (2003-11-01), Elmoursi et al.
patent: 0 523 981 (1993-01-01), None
patent: 1 187 198 (2002-03-01), None
patent: 11000728 (1999-01-01), None
patent: 2002-76551 (2002-03-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Metal/ceramic bonding substrate and method for producing same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metal/ceramic bonding substrate and method for producing same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metal/ceramic bonding substrate and method for producing same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3893143

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.