Etching a substrate: processes – Forming or treating electrical conductor article
Reexamination Certificate
2006-05-23
2006-05-23
Jones, Deborah (Department: 1775)
Etching a substrate: processes
Forming or treating electrical conductor article
C216S017000, C216S041000
Reexamination Certificate
active
07048866
ABSTRACT:
There is provided a method for producing a metal/ceramic bonding article wherein a metal member12is formed so as to have a predetermined shape by printing a resist14in a predetermined region on the metal member12to etch the metal member12after bonding the metal member12to a ceramic member10.In this method, at least one strip-like non-printed portion16having a width of, e.g. 0.01 to 0.5 mm, in which the resist is not printed, is provided in a region inwardly spaced from the outer periphery of the resist14by a predetermined distance, e.g. 0.01 to 0.5 mm, to control the etch rate in the outer peripheral portion of the metal member12.Thus, the width and thickness of a fillet is freely changed. For example, a stepped portion (or a stepped portion and fillet) having a width of 0.05 to 0.5 mm and a thickness of 0.005 to 0.25 mm is formed in the outer peripheral portion of the metal member12.
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Japanese Patent Laid-Open No. 10-326949 (published on May 26, 1997).
Kamihira Noboru
Nakamura Jynji
Bachman & LaPointe P.C.
Dowa Mining Co. Ltd.
Savage Jason L.
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