Etching a substrate: processes – Forming or treating electrical conductor article
Reexamination Certificate
2005-02-22
2005-02-22
Alanko, Anita (Department: 1765)
Etching a substrate: processes
Forming or treating electrical conductor article
C216S016000, C216S020000, C216S100000, C216S105000, C029S831000, C029S846000, C029S847000
Reexamination Certificate
active
06858151
ABSTRACT:
There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: bonding a metal plate12of an alloy containing copper and nickel directly to at least one side of a ceramic substrate10; applying a resist14on a predetermined portion of the metal plate12to remove an undesired portion of the metal plate12by etching; and removing the resist14to form a pattern having a predetermined shape of the alloy on the ceramic substrate10. According to this method, it is possible to reduce the displacement failure of parts to improve productivity and to prevent bonding failure during the mounting of a semiconductor device or the like thereon.
REFERENCES:
patent: 3766634 (1973-10-01), Babcock et al.
patent: 3993411 (1976-11-01), Babcock et al.
patent: 3994430 (1976-11-01), Cusano et al.
patent: 4409278 (1983-10-01), Jochym
patent: 4413766 (1983-11-01), Webster
patent: 4505418 (1985-03-01), Neidig et al.
patent: 4631099 (1986-12-01), Ebata et al.
patent: 4806725 (1989-02-01), Narizuka et al.
patent: 5019222 (1991-05-01), Hino et al.
patent: 6054762 (2000-04-01), Sakuraba et al.
patent: 6182358 (2001-02-01), Schulz-Harder
patent: 20030066865 (2003-04-01), Tsukaguchi et al.
patent: 20030068532 (2003-04-01), Tsukaguchi et al.
patent: 20030068537 (2003-04-01), Tsukaguchi et al.
patent: 1 298 109 (2003-04-01), None
patent: 2 059 323 (1981-04-01), None
patent: 11-097203 (1999-04-01), None
Arata, Y. et al “Studies on Solid State Reaction Bonding of Metal and Ceramic (Report I)—Bonding of Al-Mg alloy to ZrO2 ceramic” Transactions of JWRI, 1984, vol. 13, No. 1, pp 41-46.*
Grant, Julius, ed. “Hackh's Chemcial Dictionary” 1969, McGraw-Hill Book Co., 4th edition, pp 175 and 406.*
Japanese Patent Laid-Open No. 11-97203 (published on Apr. 9, 1999). Attached is a copy of the abstract.
Kimura Masami
Kitamura Yukihiro
Takahashi Takayuki
Tsukaguchi Nobuyoshi
Alanko Anita
Bachman & LaPointe P.C.
Dowa Mining Co. Ltd.
LandOfFree
Metal/ceramic bonding article and method for producing same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Metal/ceramic bonding article and method for producing same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metal/ceramic bonding article and method for producing same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3498693