Metal/ceramic bonding article and method for producing same

Details Metal/ceramic bonding article and method for producing same Metal/ceramic bonding article and method for producing same

2005-08-30

2005-08-30

Stoner, Kiley S. (Department: 1725)

Metal fusion bonding

Process

Diffusion type

C338S204000, C338S205000, C338S254000, C338S328000, C428S615000, C428S620000

Reexamination Certificate

active

06935554

ABSTRACT:
There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: arranging a metal plate12of an overall-rate solid solution type alloy on a ceramic substrate10;and heating the metal plate12and the ceramic substrate10in a non-oxidizing atmosphere at a temperature of lower than a melting point of the alloy to bond the metal plate12directly to the ceramic substrate10. According to this method, it is possible to easily bond an alloy plate directly to a ceramic substrate, and it is possible to inexpensively provide an electronic member for resistance without causing the alloy plate to be deteriorated.

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Japanese Patent Laid-Open No. 10-251075 (published on Sep. 22, 1998). Attached is a copy of the abstract.
Japanese Patent Laid-Open No. 10-326949 (published on Dec. 8, 1998). Attached is a copy of the abstract.

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