Metal case for housing an IC and a manufacturing method therefor

Special receptacle or package – For a building component – Shingle

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206329, 220 75, 29830, 295921, B65D 7302

Patent

active

048527360

ABSTRACT:
A metal case for housing electronic parts including an IC and a manufacturing method therefor are disclosed. The case comprises a shallow vessel having a wall on its periphery which is formed from metal sheet having the same thickness as the bottom of said depression and a rectangular metal ring which has a contour such that it can fit into the wall of said shallow vessel, said rectangular metal ring being fit into said shallow vessel and connected thereto so as to form a single body.

REFERENCES:
patent: 3349481 (1967-10-01), Karp
patent: 4615441 (1986-10-01), Nakamura
patent: 4758689 (1988-07-01), Nakao et al.

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