Metal carrier (leadframe) for receiving and...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...

Reexamination Certificate

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Details

C257S079000

Reexamination Certificate

active

07109524

ABSTRACT:
The invention relates to a metal carrier (leadframe) for receiving and contact-connecting electrical and/or optoelectronic components. According to the invention, the metal carrier has at least two regions of different thickness. This opens up the possibility of fitting even relatively thick electrical or optoelectronic components on a leadframe with a predetermined overall structural height.

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patent: 5367530 (1994-11-01), Noishiki et al.
patent: 5619065 (1997-04-01), Kim
patent: 6531328 (2003-03-01), Chen
patent: 2001/0009599 (2001-07-01), Kato et al.
patent: 2002/0001869 (2002-01-01), Fielstad
patent: 2002/0004251 (2002-01-01), Roberts et al.
patent: 2002/0163006 (2002-11-01), Yoganandan et al.
patent: 0 690 515 (1996-01-01), None
patent: WO 02/17405 (2002-02-01), None

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