Fishing – trapping – and vermin destroying
Patent
1991-04-17
1991-10-01
James, Andrew J.
Fishing, trapping, and vermin destroying
357 69, 357 71, 437183, H01L 2348
Patent
active
050538519
ABSTRACT:
A structure for bonding to a conductive pad on a semiconductor substrate is described. The structure comprises a glassy passivating layer with a thickness of at least 3 microns deposited over the conductive pad. The passivating layer defined an aperture which exposes a portion of the conductive pad. A metal bump covers the portion of the conductive pad exposed in the aperture and further extends over the edges of the glassy passivating layer so as to form a seal between the conductive pad and the glassy passivating layer. A subsequent thermal compression bonding operation on such structure does not cause fractures in the glassy passivating layer due to its thickness.
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Berndlmaier Erich
Das Gobinda
Viau Thomas L.
Bowers Courtney A.
International Business Machines Corp.
James Andrew J.
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