Metal bump for a thermal compression bond and method for making

Details Metal bump for a thermal compression bond and method for making Metal bump for a thermal compression bond and method for making

1991-01-14

1991-10-22

Hearn, Brian E.

Fishing, trapping, and vermin destroying

2281802, 437192, 357 68, H01L 21603

Patent

active

050595539

ABSTRACT:
A method for making a structure for bonding to a conductive pad on a semiconductor substrate is described. The structure comprises a glassy passivating layer with a thickness of at least 3 microns deposited over the conductive pad. The passivating layer defines an aperture which exposes a portion of the conductive pad. A metal bump covers the portion of the conductive pad exposed in the aperture and further extends over the edges of the glassy passivating layers so as to form a seal between the conductive pad and the glassy passivating layer. A subsequent thermal compression bonding operation on such structure does not cause fractures in the glassy passivating layer due to its thickness.

REFERENCES:
patent: 3716907 (1973-02-01), Anderson
patent: 4205099 (1980-05-01), Jones et al.
patent: 4263606 (1981-04-01), Yorikane
patent: 4970571 (1990-11-01), Yamakawa et al.

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