Metal bonded diamond aggregate abrasive

Abrasive tool making process – material – or composition – With inorganic material – Metal or metal oxide

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Details

51298, B24D 302

Patent

active

043739342

ABSTRACT:
An improved diamond aggregate abrasive is disclosed comprising milled saw diamond having an average size less than 75 microns held in a silver/copper alloy matrix which also contains a wetting agent for (e.g. titanium). Tests of grinding wheels containing this new aggregate have shown a marked improvement in grinding ratio over commercially available diamond aggregates.

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Dyer, H. B. & Codey, B. G. "Ultra-Hard Abrasives in Resin Bound Applications", Proc. DWMI Int. Tech. Symposium, 11/15/78.
Tomlinson, P. N., Notter; A. T. & Penny, A. L., CDA-M: A New Dry Grinding Abrasive for Tungsten Carbide, Ind. Diamond Review, 6/78, pp. 204-211.
De Beers, Dry Carbide Grinding Performance Boosted with CDA-M, Ind. Diamond Review, 4/78, p. 122.

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