Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent
1997-07-10
1999-09-14
Brown, Peter Toby
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
257738, 257778, 257713, H01L 2348
Patent
active
059527196
ABSTRACT:
The bending of a ball grid array electronic package having a metallic base is reduced minimizing stresses applied to the innermost row of solder balls when the package base is cyclically heated and cooled. Reducing the stresses applied to the solder balls increases the number of thermal cycles before solder ball fracture causes device failure. Among the means disclosed to reduce the bending moment are a bimetallic composite base, an integral stiffener, a centrally disposed cover bonded to an external structure and a package base with a stress accommodating depressed portion.
REFERENCES:
patent: 3248681 (1966-04-01), Reintgen
patent: 3351700 (1967-11-01), Savolainen et al.
patent: 3399332 (1968-08-01), Savolainen
patent: 4283464 (1981-08-01), Hascoe
patent: 4491622 (1985-01-01), Butt
patent: 4500605 (1985-02-01), Fister et al.
patent: 4577056 (1986-03-01), Butt
patent: 4581680 (1986-04-01), Garner
patent: 4712127 (1987-12-01), Colombo et al.
patent: 4784974 (1988-11-01), Butt
patent: 4811166 (1989-03-01), Alvarez et al.
patent: 4872047 (1989-10-01), Fister et al.
patent: 4888449 (1989-12-01), Crane et al.
patent: 4939316 (1990-07-01), Mahulikar et al.
patent: 4961105 (1990-10-01), Yamamoto
patent: 5001546 (1991-03-01), Butt
patent: 5015803 (1991-05-01), Mahulikar et al.
patent: 5044074 (1991-09-01), Hadwiger et al.
patent: 5073840 (1991-12-01), Coors
patent: 5103292 (1992-04-01), Mahulikar
patent: 5213638 (1993-05-01), Mahulikar et al.
patent: 5239131 (1993-08-01), Hoffman et al.
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5315155 (1994-05-01), O'Donnelly et al.
patent: 5409865 (1995-04-01), Karnezos
patent: 5506446 (1996-04-01), Hoffman et al.
patent: 5578869 (1996-11-01), Hoffman et al.
patent: 5629835 (1997-05-01), Mahulikar et al.
Darveaux et al. "Reliability of Plastic Ball Grid Assembly" appearing in Ball Grid Array Technology edited by John H. Lau, Chapter 13, pp. 13.1-442. McGraw-Hill, Inc. (1995).
Hoffman Paul R.
Mahulikar Deepak
Robinson Peter W.
Advanced Interconnect Technologies, Inc.
Brown Peter Toby
Potter Roy
Rosenblatt Gregory S.
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