Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent
1995-05-30
1998-02-17
Carroll, J.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
257751, 257761, 437179, H01L 2348
Patent
active
057194475
ABSTRACT:
Novel metal-alloy interconnections for integrated circuits. The metal-alloy interconnections of the present invention comprise a substantial portion of either copper or silver alloyed with a small amount of an additive having a low residual resistivity and solid solubility in either silver or copper such that the resultant electrical resistivity is less than 3 .mu..OMEGA.-cm.
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Full English translation of Japan Kokai 5-47760 as per USPTO.
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Carroll J.
Intel Corporation
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