Metal-alloy interconnections for integrated circuits

Details Metal-alloy interconnections for integrated circuits Metal-alloy interconnections for integrated circuits

1997-08-06

2000-09-19

Lohe, Steven

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257751, 257761, H01L 2348

Patent

active

061216852

ABSTRACT:
Novel metal-alloy interconnections for integrated circuits. The metal-alloy interconnections of the present invention comprise a substantial portion of either copper or silver alloyed with a small amount of an additive having a low residual resistivity and solid solubility in either silver or copper such that the resultant electrical resistivity is less than 3 .mu..OMEGA.-cm.

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