Meso-microelectromechanical system package

Details Meso-microelectromechanical system package Meso-microelectromechanical system package

2005-02-22

2005-02-22

Pascal, Robert (Department: 2817)

Wave transmission lines and networks

Long line elements and components

Switch

C200S181000

Reexamination Certificate

active

06859119

ABSTRACT:
A mesoscale microelectromechanical system (MEMS) package for a micro-machine. The mesoscale micro-machine is formed on a printed circuit board (10) at the same time and of the same materials as the mesoscale micro-machine package. Both the micro-machine and the package have a first metal layer (12, 16), an insulating member (22, 26) formed on the first metal layer, and a second metal layer (32, 36) situated on the insulating layer. The package consists of a perimeter wall surrounding the micro-machine and a low-flow capping adhesive layer (40). The first metal layers of both the micro-machine and the package are formed in the same process sequence, and the insulating layers of both the micro-machine and the package are formed in the same process sequence, and the second metal layers of both the micro-machine and the package are formed in the same process sequence. The low-flow capping adhesive secures an optional cover (46) on the package to provide an environmental seal.

REFERENCES:
patent: 6600712 (2003-07-01), Masui et al.
patent: 6649852 (2003-11-01), Chason et al.
patent: 6661084 (2003-12-01), Peterson et al.

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