Mesh structure to avoid thermal grease pump-out in integrated ci

Details Mesh structure to avoid thermal grease pump-out in integrated ci Mesh structure to avoid thermal grease pump-out in integrated ci

1999-02-16

2000-09-19

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257720, 257741, 257746, 257747, 257782, 257783, H01L 2334

Patent

active

061216801

ABSTRACT:
An embodiment of the invention includes an integrated circuit package having a substrate, an integrated circuit mounted to the substrate, a thermal element, and a heat pipe disposed between the integrated circuit and the thermal element. The heat pipe includes a retaining structure impregnated with a thermal grease. The heat pipe is a result of a process that includes the step of impregnating the retaining structure with a thermal grease prior to disposing the heat pipe between the integrated circuit and the thermal element.

REFERENCES:
patent: 3399332 (1968-08-01), Savolainen
patent: 4130233 (1978-12-01), Chisholm
patent: 4295151 (1981-10-01), Nyul et al.
patent: 4384610 (1983-05-01), Cook et al.
patent: 4446916 (1984-05-01), Hayes
patent: 4482912 (1984-11-01), Chiba et al.
patent: 5323294 (1994-06-01), Layton et al.
patent: 5459352 (1995-10-01), Layton et al.
patent: 5783862 (1998-07-01), Deeney

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