Mesh shaped dam mounted on a substrate

Details Mesh shaped dam mounted on a substrate Mesh shaped dam mounted on a substrate

2007-02-20

2007-02-20

Chambliss, Alonzo (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S738000, C257S780000, C257SE23135, C361S770000, C361S771000

Reexamination Certificate

active

10933348

ABSTRACT:
A substrate is provided for carrying at least a semiconductor device. The substrate mainly includes a carrier body, a plurality of contact pads, a solder mask and a plurality of dams of a mesh. The contact pads are disposed on a surface of the carrier body and each has a bonding surface exposed out of the solder mask for connecting with the external terminals of the semiconductor device. The dams are disposed above the surface of the carrier body. The dams protrude from and located between the bonding surfaces of the contact pads to prevent solder paste, flux or the external terminals of the semiconductor device from bridging.

REFERENCES:
patent: 5726501 (1998-03-01), Matsubara
patent: 5796590 (1998-08-01), Klein
patent: 5929521 (1999-07-01), Wark et al.
patent: 6084781 (2000-07-01), Klein
patent: 6833615 (2004-12-01), Geng et al.
patent: 6921860 (2005-07-01), Peterson et al.
patent: 2005/0087867 (2005-04-01), Liu
patent: 200386928 (2003-03-01), None
patent: 466719 (2001-12-01), None
patent: WO96/08056 (1996-03-01), None

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