Mesa fabrication process

Chemistry: electrical and wave energy – Processes and products – Vacuum arc discharge coating

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29580, 156643, 156649, 2041293, 20412935, 20412965, 20412975, C23C 1500

Patent

active

040071049

ABSTRACT:
A method of manufacturing a semiconductor device wherein a semiconductor layer of one conductivity type is provided on a semiconductor body of the same conductivity type but of higher conductivity, a mesa is formed by etching away with a reactive gas plasma the semiconductor material around a masked area defining a mesa, and the mesa is then undercut by further etching by a gas plasma that removes material of the body faster than material of the layer so as to produce a bevelled mesa.

REFERENCES:
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patent: 3730800 (1973-05-01), Nakashima et al.
patent: 3742593 (1973-07-01), Smith
patent: 3839177 (1974-10-01), Dimigen
patent: 3878008 (1975-04-01), Gleason et al.
patent: 3880684 (1975-04-01), Abe
patent: 3894895 (1975-07-01), Khandelwal
patent: 3898141 (1975-08-01), Ermanis et al.
patent: 3925078 (1975-12-01), Kroger et al.
DE Nobel et al., "Impatt Diodes," Philips Tech. Rev., vol. 32, pp. 328-344 (1971).
Appels et al., "Local Oxidation of Silicon and Its Application in Semiconductor-Device Technology," Philips Res. Reports, vol. 25, pp. 118-132 (1970).
R. A. Cohen, "Si.sub.3 N.sub.4 -Masked Thermally Oxidized Post-Diffused Mesa Process (Simtop)," IEE Trans Electron Devices vol. ed-18, pp. 54-57 (1971).
R. M. Valletta, "Control of Edge Profile in Sputter Etching," IBM Tech. Disc. Bull., vol. 10, No. 12, May 1968, p. 1974.

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