MEMS sensor systems and methods

Measuring and testing – Speed – velocity – or acceleration – Response to multiple sensing means or motion conditions

Reexamination Certificate

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C073S493000

Reexamination Certificate

active

11260817

ABSTRACT:
MEMS Sensor Systems and Methods are provided. In one embodiment, a method for producing a six degree of freedom inertial sensor is provided. The method comprises fabricating a first silicon wafer segment having at least one inertial sensor pair, the at least one inertial sensor pair comprising one or both of a pair of orthogonally oriented accelerometers and a pair of orthogonally oriented gyroscopes; fabricating a second silicon wafer segment having at least one inertial sensor, the at least one inertial sensor comprising one or both of an accelerometer and a gyroscope; assembling together the first silicon wafer segment and the second silicon wafer segment such that the at least one inertial sensor pair and the at least one inertial sensor are oriented orthogonal to each other; and bonding the first silicon wafer segment to the second silicon wafer segment.

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patent: 6128955 (2000-10-01), Mimura
patent: 6195261 (2001-02-01), Babutzka et al.
patent: 6876926 (2005-04-01), Kirkland et al.
patent: 7040922 (2006-05-01), Harney et al.

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