Measuring and testing – With fluid pressure – Leakage
Reexamination Certificate
2007-05-01
2007-05-01
Williams, Hezron (Department: 2856)
Measuring and testing
With fluid pressure
Leakage
Reexamination Certificate
active
11163388
ABSTRACT:
Methods and apparatus are provided for detecting leaks in a MEMS sensor package, and in particular, a MEMS sensor package that includes an oscillating structure or element that has a Quality (Q) value. The method and apparatus may include measuring the Q value of the MEMS sensor at a first time, applying a pressure to the outside of the MEMS sensor package, and measuring the Q value of the MEMS sensor at a second time after pressure has been applied for a period of time. A change in the measured Q values between the first time and the second time may be determined, which may then be correlated to a leak rate for the particular MEMS sensor package. In some cases, a leak rate of 2×10−13He atm.cc/s or less may be detected.
REFERENCES:
patent: 4608866 (1986-09-01), Begquist
patent: 4893497 (1990-01-01), Danielson
patent: 5307139 (1994-04-01), Tyson, II et al.
patent: 5398543 (1995-03-01), Fukushima et al.
patent: 5639958 (1997-06-01), Lange
patent: 6286362 (2001-09-01), Coffman et al.
patent: 6536260 (2003-03-01), Williams
patent: 6595040 (2003-07-01), Widt et al.
patent: 6959583 (2005-11-01), Platt
patent: 2005/0081605 (2005-04-01), Chin
“Deparment of Defense Test Method Standard Microcircuits,” United States of America, Department of Defense, 708 pages, Jun. 18, 2004.
“Deparment of Defense Test Method Standard Semiconductor Devices,” United States of America, Department of Defense, 578 pages, Feb. 28, 1995.
Soucy et al., “Aluminum Nitride Chip Carrier for Microelectromechanical Sensor Applications,” Proceedings of the 2002 MRS Fall Meeting, vol. 741, 4 pages, 2002.
Bundis, Esq. Evan
Fitzgerald John
Honeywell International , Inc.
Williams Hezron
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