MEMS RF switch module including a vertical via

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S415000, C257S728000, C174S262000, C361S767000, C361S768000

Reexamination Certificate

active

10606633

ABSTRACT:
An apparatus and method to provide a micro-electromechanical systems (MEMS) radio frequency (RF) switch module with a vertical via. The MEMS RF switch module includes a MEMS die coupled to a cap section. The vertical via passes through the cap section to electrically couple an RF switch array of the MEMS die to a printed circuit board (PCB). In one embodiment, the MEMS die includes a trace ring surrounding at least a portion of the RF switch array so that a signal may enter or exit the MEMS RF switch module using the vertical via without crossing the trace ring.

REFERENCES:
patent: 6384353 (2002-05-01), Huang et al.
patent: 6396711 (2002-05-01), Degani et al.
patent: 6426484 (2002-07-01), Hembree et al.
patent: 6509816 (2003-01-01), Staker et al.
patent: 6511894 (2003-01-01), Song
patent: 6559530 (2003-05-01), Hinzel et al.
patent: 6673697 (2004-01-01), Ma et al.
patent: 6713314 (2004-03-01), Wong et al.
patent: 6852926 (2005-02-01), Ma et al.
patent: 6853067 (2005-02-01), Cohn et al.
patent: 6876056 (2005-04-01), Tilmans et al.
patent: 6891239 (2005-05-01), Anderson et al.
patent: 6900773 (2005-05-01), Poilasne et al.
patent: 6903452 (2005-06-01), Ma et al.
patent: 6914323 (2005-07-01), Curtis et al.
patent: 2002/0000649 (2002-01-01), Tilmans
patent: 2003/0001251 (2003-01-01), Cheever et al.
patent: 2003/0047799 (2003-03-01), Cheever et al.
patent: 2004/0012464 (2004-01-01), Ma et al.
patent: 2004/0262645 (2004-12-01), Huff et al.
patent: 2005/0006738 (2005-01-01), Schaper et al.
patent: 2005/0024165 (2005-02-01), Hsu

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

MEMS RF switch module including a vertical via does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with MEMS RF switch module including a vertical via, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and MEMS RF switch module including a vertical via will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3739175

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.