Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate
2007-01-30
2007-01-30
Cuneo, Kamand (Department: 2841)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With semiconductor element forming part
C257S415000, C257S728000, C174S262000, C361S767000, C361S768000
Reexamination Certificate
active
10606633
ABSTRACT:
An apparatus and method to provide a micro-electromechanical systems (MEMS) radio frequency (RF) switch module with a vertical via. The MEMS RF switch module includes a MEMS die coupled to a cap section. The vertical via passes through the cap section to electrically couple an RF switch array of the MEMS die to a printed circuit board (PCB). In one embodiment, the MEMS die includes a trace ring surrounding at least a portion of the RF switch array so that a signal may enter or exit the MEMS RF switch module using the vertical via without crossing the trace ring.
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Chou Tsung-Kuan Allen
Hayden, III Joseph S.
Heck John M.
Cuneo Kamand
Nguyen Hoa C.
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