MEMS packaging using a non-silicon substrate for...

Details MEMS packaging using a non-silicon substrate for... MEMS packaging using a non-silicon substrate for...

2003-06-30

2008-05-06

Lee, Hsien-Ming (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S684000, C257S704000, C438S106000, C438S107000

Reexamination Certificate

active

07368808

ABSTRACT:
A MEMS die is bonded to a cap to form a MEMS device. The cap is non-silicon and has an electrical via extending from one side of the cap to another side of the cap. In one embodiment, a plurality of caps is wafer bonded to a plurality of MEMS dice.

REFERENCES:
patent: 6630725 (2003-10-01), Kuo et al.
patent: 6846725 (2005-01-01), Nagarajan et al.
patent: 7170155 (2007-01-01), Heck et al.

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