MEMS packaging structure and methods

Details MEMS packaging structure and methods MEMS packaging structure and methods

2007-10-30

2007-10-30

Kebede, Brook (Department: 2823)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S456000, C257S774000, C257SE21122

Reexamination Certificate

active

11104704

ABSTRACT:
A MEMS article is made by forming a MEMS device on a first substrate, providing a second substrate, depositing a layer of etchable dielectric material, forming at least one lateral post-bond release-etch port by a damascene process using a sacrificial material, and bonding the two substrates together.

REFERENCES:
patent: 5427975 (1995-06-01), Sparks et al.
patent: 5798283 (1998-08-01), Montague et al.
patent: 5963788 (1999-10-01), Barron et al.
patent: 6335224 (2002-01-01), Peterson et al.
patent: 6337027 (2002-01-01), Humphrey
patent: 6379988 (2002-04-01), Peterson et al.
patent: 6425971 (2002-07-01), Silverbrook
patent: 6502306 (2003-01-01), Silverbrook
patent: 6531331 (2003-03-01), Bennett et al.
patent: 6535663 (2003-03-01), Chertkow
patent: 6569701 (2003-05-01), Knieser et al.
patent: 6635506 (2003-10-01), Volant et al.
patent: 6756310 (2004-06-01), Kretschmann et al.
patent: 6770506 (2004-08-01), Gogoi
patent: 6770569 (2004-08-01), Foerstner et al.
patent: 6790698 (2004-09-01), Miller et al.
patent: 6798029 (2004-09-01), Volant et al.
patent: 6830950 (2004-12-01), Chinn et al.
patent: 6838302 (2005-01-01), Huibers
patent: 6844623 (2005-01-01), Peterson et al.
patent: 6846692 (2005-01-01), Silverbrook
patent: 2002/0048839 (2002-04-01), Miller et al.
patent: 2002/0146200 (2002-10-01), Kudrle et al.
patent: 2002/0174541 (2002-11-01), Silverbrook
patent: 2003/0060051 (2003-03-01), Kretschmann et al.
patent: 2003/0082928 (2003-05-01), Knieser et al.
patent: 2003/0134449 (2003-07-01), Huibers
patent: 2003/0138986 (2003-07-01), Bruner
patent: 2003/0139018 (2003-07-01), Silverbrook
patent: 2003/0146464 (2003-08-01), Prophet
patent: 2003/0153116 (2003-08-01), Carley et al.
patent: 2003/0166342 (2003-09-01), Chinn et al.
patent: 2003/0218227 (2003-11-01), Singh et al.
patent: 2004/0012057 (2004-01-01), Bennett et al.
patent: 2004/0012061 (2004-01-01), Reid et al.
patent: 2004/0023429 (2004-02-01), Foerstner et al.
patent: 2004/0033011 (2004-02-01), Chertkow
patent: 2004/0033639 (2004-02-01), Chinn et al.
patent: 2004/0053434 (2004-03-01), Bruner
patent: 2004/0065940 (2004-04-01), Ayazi et al.
patent: 2004/0119125 (2004-06-01), Gogoi et al.
patent: 2004/0121506 (2004-06-01), Gogoi
patent: 2004/0125346 (2004-07-01), Huibers
patent: 2004/0173886 (2004-09-01), Carley
patent: 2004/0263944 (2004-12-01), Miles et al.
patent: 2005/0002084 (2005-01-01), Wan
patent: 2005/0007217 (2005-01-01), Deligianni et al.
patent: 2006/0076311 (2006-04-01), Tung et al.
K. B. Lee et al. “Zinc Bonding for MEMS Packaging at the Wafer Level” MicroElectro-Mechanical Systems Systems (MEMS) 2001, IMECE2001 (ASME, New York) Nov. 11, 2001 pp. 707-710.
K. Gilleo, “MEMS, MOEMS and Optoelectronics” MicroElectro-Mechanical Systems Systems (MEMS) 2001. IMECE2001 (ASME, New York) Nov. 11, 2001 pp. 711-718.
L. Hornbeck et al. “Digital Micromirror Device—Commercialization . . . ” MicroElectro-Mechanical Systems Systems (MEMS) 1997, DSC-vol. 62 (ASME, Dallas, TX) Nov. 16, 1997 pp. 3-8.
K. D. Wise, “Micromechanical Sensors, Actuators and Systems” Micromechanical Sensors, Actuators, and Systems, DSC-vol. 32 (ASME, Atlanta, GA) Nov. 1-6, 1991 pp. 1-14.
L. Field et al. “Fusing Silicon Wafers with Low Melting Temperature Glass” Transducers '89 Jun. 1990, reprinted in Micromechanics and MEMS, IEEE, New York (1991) pp. 592-595.
M. Esashi et al. “Low-temperature Silicon-to-silicon Anodic Bonding . . . ” Transducers '89 Jun. 1990, reprinted in Micromechanics and MEMS, IEEE Press, New York (1991) pp. 588-591.
P. Barth, “Silicon Fusion Bonding for Fabrication of Sensors, Actuators . . . ” Transducers '89 Jun. 1990. reprinted in Micromechanics and MEMS, IEEE, New York (1991) pp. 596-603.
K. Petersen et al. “Silicon Fusion Bonding for Pressure Sensors” Jun. 1988. reprinted in Micromechanics and MEMS, IEEE Press, New York (1991) pp. 584-587.
G. Kaminsky “Micromachining of Silicon Mechanical Structures” Jul./Aug. 1985 reprinted in Micromechanics and MEMS, IEEE Press, New York (1991) pp. 555-583.
K. Petersen “Micromechanical Membrane Switches on Silicon” IBM J. Res. Develop. V.23/4 (Jul. 1979) pp. 376-385.

Affiliated with

Also associated with

Rating

MEMS packaging structure and methods does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with MEMS packaging structure and methods, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and MEMS packaging structure and methods will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3858302