Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
Reexamination Certificate
2007-04-10
2007-04-10
Andujar, Leonardo (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
With shielding
C257S704000, C257S710000, C257SE23193
Reexamination Certificate
active
11182254
ABSTRACT:
A MEMS package and a method for its forming are described. The MEMS package has at least one MEMS device located on a flexible substrate. A metal structure surrounds the at least one MEMS device wherein a bottom surface of the metal structure is attached to the flexible substrate and wherein a portion of the flexible substrate is folded over a top surface of the metal structure and attached to the top surface of the metal structure thereby forming the MEMS package.
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Yubo Miao
Zhe Wang
Ackerman Stephen B.
Andujar Leonardo
Pike Rosemary L. S.
Saile Ackerman LLC
Sandvik Benjamin P.
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