MEMS package

Details MEMS package MEMS package

2005-01-11

2005-01-11

Lebentritt, Michael (Department: 2824)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S685000, C257S686000, C257S257000, C257S780000

Reexamination Certificate

active

06841861

ABSTRACT:
A wafer-level packaging process for MEMS applications, and a MEMS package produced thereby, in which a SOI wafer is bonded to a MEMS wafer and the electrical feed-throughs are made through the SOI wafer. The method includes providing a first substrate having the functional element thereon connected to at least one metal lead, and providing a second SOI substrate having a recessed cavity in a silicon portion thereof with metal connectors formed in the recessed cavity. The non-recessed surfaces of the SOI substrate are bonded to the first substrate to form a hermetically sealed cavity. Within the cavity, the metal leads are bonded to respective metal connectors. Prior to bonding, the recessed cavity has a depth that is greater than the thickness of the functional element and less than the combined thickness of the metal leads and their respective metal connectors. After bonding, silicon from the SOI substrate is removed to expose the buried oxide portion of the SOI substrate. Metal pads are then formed through the SOI substrate to the metal connectors within the cavity. Wire bond pads are thereby connected to the functional element without opening the cavity to the environment. Electrical signals may then be fed through the SOI wafer to the metal connectors, metal leads and the functional element.

REFERENCES:
patent: 5278368 (1994-01-01), Kasano et al.
patent: 5929498 (1999-07-01), Ismail et al.
patent: 6124636 (2000-09-01), Kusamitsu
patent: 6326682 (2001-12-01), Kurtz et al.
patent: 6369931 (2002-04-01), Funk et al.
patent: 6436853 (2002-08-01), Lin et al.
patent: 6448109 (2002-09-01), Karpman
patent: 6452238 (2002-09-01), Orcutt et al.
patent: 6469909 (2002-10-01), Simmons
patent: 6486425 (2002-11-01), Seki
patent: 6503831 (2003-01-01), Speakman
patent: 6506620 (2003-01-01), Scharf et al.
patent: 6519075 (2003-02-01), Carr et al.
patent: 6528351 (2003-03-01), Nathan et al.
patent: 6528869 (2003-03-01), Glenn et al.
patent: 6548895 (2003-04-01), Benavides et al.
patent: 6555417 (2003-04-01), Spooner et al.
patent: 6569754 (2003-05-01), Wong et al.
patent: 6574026 (2003-06-01), Jin et al.
patent: 6590267 (2003-07-01), Goodwin-Johansson et al.
patent: 6624003 (2003-09-01), Rice
patent: 6661084 (2003-12-01), Peterson et al.
patent: 6674159 (2004-01-01), Peterson et al.
patent: 6771859 (2004-08-01), Carpenter
patent: 6773962 (2004-08-01), Saia et al.
patent: 6780672 (2004-08-01), Steele et al.

Affiliated with

Also associated with

Rating

MEMS package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with MEMS package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and MEMS package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3404144