Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2006-03-03
2008-10-14
Dang, Trung (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257SE23003, C438S051000
Reexamination Certificate
active
07436054
ABSTRACT:
A MEMS microphone with a stacked PCB package is described. The MEMS package has at least one MEMS acoustic sensor device located on a PCB stack. A metal cap structure surrounds the at least one MEMS acoustic sensor device wherein an edge surface of the metal cap structure is attached and electrically connected to the PCB stack. In a first embodiment, a back chamber is formed underlying the at least one MEMS acoustic sensor device and within the PCB stack wherein an opening underlying the at least one MEMS acoustic sensor device accesses the back chamber. An opening in the metal cap structure not aligned with the at least one MEMS acoustic sensor device allows external fluid, acoustic energy or pressure to enter the at least one MEMS acoustic sensor device. In a second embodiment, a back chamber is formed in the space under the metal cap and over the first PCB. A hollow chamber is formed between the first PCB and the second PCB wherein an opening under the at least one MEMS acoustic sensor device accesses the hollow chamber. An opening in a bottom surface of the PCB stack not aligned with the at least one MEMS acoustic sensor device also accesses the hollow chamber and allows external fluid, acoustic energy or pressure to enter the at least one MEMS acoustic sensor device.
REFERENCES:
patent: 6781231 (2004-08-01), Minervini
patent: 7202552 (2007-04-01), Zhe et al.
patent: 2002/0102004 (2002-08-01), Minervini
patent: 2007/0013052 (2007-01-01), Zhe et al.
patent: 2007/0040231 (2007-02-01), Harney et al.
Co-pending U.S. Patent App. AL-05-001, U.S. Appl. No. 11/182,254, filed Jul. 15, 2005, “A MEMS Package Using Flexible Substrates, and Method Thereof”, assigned to the same assignee as the present invention.
Co-pending U.S. Patent App. AL-05-005, U.S. Appl. No. 11/333,579, filed Jan. 17, 2006, “A MEMS Packaging Method for Enhanced EMI Immunity Using Flexible Substrates”, assigned to the same assignee as the present invention.
Ackerman Stephen B.
Dang Trung
Pike Rosemary L. S.
Saile Ackerman LLC
Silicon Matrix Pte. Ltd.
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