MEMS microphone package with RF insensitive MEMS microphone...

Details MEMS microphone package with RF insensitive MEMS microphone... MEMS microphone package with RF insensitive MEMS microphone...

2008-06-12

2011-12-06

Tran, Long (Department: 2829)

Electrical audio signal processing systems and devices

Electro-acoustic audio transducer

Housed microphone

C381S091000, C381S162000, C381S178000, C381S189000, C381S316000, C381S369000, C381S372000, C381S402000

Reexamination Certificate

active

08073179

ABSTRACT:
A micro-electro-mechanical-system microphone package includes a substrate, a micro-electro-mechanical-system microphone chip mounted on the substrate, and a cover attached to the substrate to cover the micro-electro-mechanical-system microphone chip. The cover is provided with a sound inlet through which the micro-electro-mechanical-system microphone receives external sound. The micro-electro-mechanical-system microphone chip includes a conductive base connected to a constant voltage, a shielding layer supported by the conductive base and connected to the constant voltage, a diaphragm disposed between the conductive base and the shielding layer, and a back plate also disposed between the conductive base and the shielding layer.

REFERENCES:
patent: 2006/0177083 (2006-08-01), Sjursen et al.
patent: 2007/0057602 (2007-03-01), Song

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