Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material
Reexamination Certificate
2005-12-20
2005-12-20
Mckinnon, Terrell (Department: 3743)
Heat exchange
Intermediate fluent heat exchange material receiving and...
Liquid fluent heat exchange material
C165S104260, C165S080400, C361S700000, C257S715000, C174S015200
Reexamination Certificate
active
06976527
ABSTRACT:
A microcapillary pumped loop (CPL) for chip level temperature control includes two mating substrates which define an evaporator, a condenser, and a reservoir for a liquid. A first substrate includes a vapor line which couples vapor from the evaporator to the condenser, and a liquid line which couples liquid from the condenser back to the evaporator. A wicking structure for the evaporator is formed by etching in the second substrate. The wicking structure couples the evaporator to the reservoir and to the liquid line. The condenser includes a plurality of grooves formed in the second substrate which couples liquid from the condenser to the liquid line.
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Kirshberg Jeffrey
Liepmann Dorian
Yerkes Kirk L.
Beyer Weaver & Thomas LLP
Mckinnon Terrell
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