MEMS heat pumps for integrated circuit heat dissipation

Details MEMS heat pumps for integrated circuit heat dissipation MEMS heat pumps for integrated circuit heat dissipation

2006-09-19

2006-09-19

Jiang, Chen Wen (Department: 3744)

Refrigeration

Structural installation

With electrical component cooling

C165S104330, C361S689000, C257S713000

Reexamination Certificate

active

07107777

ABSTRACT:
A cooling mechanism within an integrated circuit includes an internal pump for circulating thermally conductive fluid within closed loop channels. The cooling channels are embedded within an integrated circuit die, such as in interlevel dielectric layers between metal levels. The channels are formed by engineering deposition of a layer to line trenches and form continuous voids along the trenches. Exemplary heat pumps comprise cavities, formed in communication with the channels, covered by piezoelectric actuators. Preferably, the actuators are wired to act in sequence as a peristaltic pump, circulating the fluid within the channels. The channels are positioned to carry heat from active devices within the integrated circuit, and a heat sink carries heat from the die.

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