Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal
Reexamination Certificate
2006-03-22
2008-05-27
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
C438S106000, C438S108000, C438S114000, C438S463000, C257SE31001, C257SE27001
Reexamination Certificate
active
07378293
ABSTRACT:
A method for singulating a substrate such as a semiconductor wafer populated with a plurality of MEMS devices. A preferred embodiment of the present invention comprises mounting a glass cover onto the wafer, then orienting the wafer and removably mounting it on an adhesive tape. A partial cut or series of partial cuts is then made through the cover to facilitate the later removal of selected cover portions using an automated process. The dice are then separated using a series of full cuts made perpendicular and parallel to the partial cuts and the selected cover portions removed from each die. The separated dice are then packaged for use or for further fabrication.
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Brady III W. James
Lebentritt Michael
Mustapha Abdulfattah
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
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