MEMS driver circuit arrangement

Details MEMS driver circuit arrangement MEMS driver circuit arrangement

2005-07-26

2005-07-26

Lee, John D. (Department: 2874)

Optical waveguides

With optical coupler

Switch

C385S092000, C257S678000, C257S773000, C257S777000

Reexamination Certificate

active

06922499

ABSTRACT:
A packaged MEMS device containing the micro mirrors has mounted on it at least two distinct integrated circuit chips, at least one of which contains the low-voltage digital-to-analog converts and at least one of which contains the high-voltage amplifiers. The integrated circuit chips may be mounted directly to the MEMS package, or they may be indirectly mounted thereto, e.g., by being directly mounted to a multi-chip module which is in turn mounted on the package. Thus, the MEMS package is employed in a dual role, 1) that of package for the MEMS device and 2) the role of a backplane in that it contains mounting places and the wires interconnecting the MEMS device and chips or modules containing the low-voltage digital-to-analog converters and the high-voltage amplifiers.

REFERENCES:
patent: 6638784 (2003-10-01), Bartlett et al.
patent: 2003/0102572 (2003-06-01), Nathan et al.
patent: 2003-75741 (2003-03-01), None

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