Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2007-06-05
2007-06-05
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S113000, C438S460000, C257SE21499
Reexamination Certificate
active
11157024
ABSTRACT:
A method and system in which a semiconductor wafer having a plurality of dies is inspected through a visual inspection and/or an electrical test. If certain of the dies on the wafer pass the inspection, then windows are mounted or affixed above those certain dies while they are still a part of the wafer.
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Knipe Richard L.
Kocian Thomas A.
Strumpell Mark H.
Brady III Wade James
Brill Charles A.
Geyer Scott B.
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
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