MEMS device wafer-level package

Details MEMS device wafer-level package MEMS device wafer-level package

2005-06-21

2005-06-21

Geyer, Scott B. (Department: 2829)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S116000, C438S118000

Reexamination Certificate

active

06908791

ABSTRACT:
A method and system in which a semiconductor wafer having a plurality of dies is inspected through a visual inspection and/or an electrical test. If certain of the dies on the wafer pass the inspection, then windows are mounted or affixed above those certain dies while they are still a part of the wafer.

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