MEMS device seal using liquid crystal polymer

Details MEMS device seal using liquid crystal polymer MEMS device seal using liquid crystal polymer

2008-09-02

2008-09-02

Reichard, Dean A. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S783000, C361S748000, C361S790000, C361S807000, C257S777000, C257S778000, C174S541000

Reexamination Certificate

active

11328992

ABSTRACT:
An apparatus and method for a near hermetic chip carrier package having a base die and a lid die each formed of a substantially impermeable material and conjoined by a semi-permeable sheet or tape substrate of only a few thousands of an inch thickness that is formed of two or more thermotropic liquid crystal polymer (LCP) films laminated over a selected number of metal electrical conductors carrying signals into and out of package.

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