Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2009-09-04
2011-11-15
Nguyen, Ha Tran T (Department: 2829)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C438S051000, C438S106000, C438S048000, C438S049000, C438S050000, C257SE23193, C257S678000, C257S415000, C257S414000
Reexamination Certificate
active
08058106
ABSTRACT:
In a method of vacuum packaging a MEMS device, at least one MEMS device is attached on a substrate. A solder preform is printed on the substrate at the perimeter surrounding the substrate. A lid is attached to the solder preform wherein the lid provides a cavity enclosing the at least one MEMS device. A first reflowing step reflows the solder at a first temperature, partially sealing the lid/substrate interface and at the same time does the outgassing and baking procedure for the packaging. Flux is applied onto an outer ring of the solder preform and a second step reflows the solder at a second temperature, completely sealing the lid/substrate interface and providing a vacuum cavity enclosing the at least one MEMS device.
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Huang Rueyshing Star
Wu Mei-Ling
Ackerman Stephen B.
Dehne Aaron
MagIC Technologies, Inc.
Nguyen Ha Tran T
Pike Rosemary L. S.
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