MEMS device and method of forming MEMS device

Details MEMS device and method of forming MEMS device MEMS device and method of forming MEMS device

2007-12-18

2007-12-18

Loke, Steven (Department: 2818)

Optical: systems and elements

Deflection using a moving element

By moving a reflective element

C359S291000, C359S290000, C257S415000, C257S678000

Reexamination Certificate

active

11019780

ABSTRACT:
A method of forming a MEMS device includes depositing a conductive material on a substructure, forming a first sacrificial layer over the conductive material, including forming a substantially planar surface of the first sacrificial layer, and forming a first element over the substantially planar surface of the first sacrificial layer, including communicating the first element with the conductive material through the first sacrificial layer. In addition, the method includes forming a second sacrificial layer over the first element, including forming a substantially planar surface of the second sacrificial layer, forming a support through the second sacrificial layer to the first element after forming the second sacrificial layer, including, filling the support, and forming a second element over the support and the substantially planar surface of the second sacrificial layer. As such, the method further includes substantially removing the first sacrificial layer and the second sacrificial layer, thereby supporting the second element relative to the first element with the support.

REFERENCES:
patent: 5485304 (1996-01-01), Kaeriyama
patent: 5497262 (1996-03-01), Kaeriyama
patent: 5583688 (1996-12-01), Hornbeck
patent: 5631782 (1997-05-01), Smith et al.
patent: 5646768 (1997-07-01), Kaeriyama
patent: 5650881 (1997-07-01), Hornbeck
patent: 5703728 (1997-12-01), Smith et al.
patent: 5919548 (1999-07-01), Barron et al.
patent: 6025951 (2000-02-01), Swart et al.
patent: 6038056 (2000-03-01), Florence et al.
patent: 6121552 (2000-09-01), Brosnihan et al.
patent: 6147790 (2000-11-01), Meier et al.
patent: 6323982 (2001-11-01), Hornbeck
patent: 6396368 (2002-05-01), Chow et al.
patent: 6440766 (2002-08-01), Clark
patent: 6469330 (2002-10-01), Vigna et al.
patent: 6480320 (2002-11-01), Nasiri
patent: 6522454 (2003-02-01), Meier et al.
patent: 6523961 (2003-02-01), Ilkov et al.
patent: 7022249 (2006-04-01), Valette
patent: 7023606 (2006-04-01), Huibers
patent: 2002/0039470 (2002-04-01), Braun et al.
patent: 2003/0034535 (2003-02-01), Barenburg et al.
patent: 2003/0124462 (2003-07-01), Miller
patent: 2004/0156090 (2004-08-01), Patel et al.
patent: 0 469 293 (1992-02-01), None
patent: 1093143 (2001-04-01), None
patent: 2000314634 (2001-07-01), None
patent: WO 02/12925 (2002-02-01), None
Bikram Baidaya et al., “Layout Verification and Correction of CMOS-MEMS Layouts”, Carnegie Mellon University, Pittsburgh.
Jeffrey D. Zahn et al., A Direct Plasma Etch Approach to High Aspect Ratio Polymer Micromachining With Applications in Biomems and CMOS-MEMS, 2002 IEEE, pp. 137-140.
Jim Hunter et al., “CMOS friendly MEMS manufacturing process”, 1998 IEEE, pp. 103-104.
J.H. Smith et al., “Material and Processing Issues for the Monolithic Integration of Microelectronics with Surface-Micromachined Polysilicon Sensors and Actuators” SPIE, Oct. 1995, pp. 1-10.
Oliver Brand, “CMOS-based MEMS/DTU PhD Course/Topics in Microelectronics”, Physical Electronics Laboratory, ETH Zurich, http://www.lqe.ethz.ch/pel, slides A-2 through A-36, 2002.
J.H. Smith et al., “Embedded Micromechanical Devices for the Monolithic Integration of MEMS with CMOS”, 1995 IEEE, pp. 609-612.

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