MEMS device and method of forming MEMS device

Optical: systems and elements – Optical modulator – Light wave temporal modulation

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C359S292000, C359S295000, C359S224200, C427S162000, C427S534000, C438S024000, C438S048000, C438S599000, C438S691000, C438S734000

Reexamination Certificate

active

06917459

ABSTRACT:
A method of forming a MEMS device includes providing a substructure including a base material and at least one conductive layer formed on a first side of the base material, forming a dielectric layer over the at least one conductive layer of the substructure, forming a protective layer over the dielectric layer, defining an electrical contact area for the MEMS device on the protective layer, and forming an opening within the electrical contact area through the protective layer and the dielectric layer to the at least one conductive layer of the substructure.

REFERENCES:
patent: 5620931 (1997-04-01), Tsang et al.
patent: 5919548 (1999-07-01), Barron et al.
patent: 6121552 (2000-09-01), Brosnihan et al.
patent: 6396368 (2002-05-01), Chow et al.
patent: 6440766 (2002-08-01), Clark
patent: 6469330 (2002-10-01), Vigna et al.
patent: 6480320 (2002-11-01), Nasiri
patent: 6523961 (2003-02-01), Ilkov et al.
patent: 2002/0039470 (2002-04-01), Braun et al.
patent: 2002/0109903 (2002-08-01), Kaeriyama
patent: 2003/0034535 (2003-02-01), Barenburg et al.
patent: 10017422 (2001-10-01), None
patent: 1093143 (2001-04-01), None
patent: 2000314634 (2001-07-01), None
Kyu-Ho Hwang et al, “Thin-Film Micromirror Array for High-Brightness Projection Displays”, J. Appl. Phys, v. 37 (1998), pp 7074-7077.
J.H. Smith et al., “Material and Processing Issues for the Monolithic Integration of Microelectronics with Surface-Micromachined Polysilicon Sensors and Actuators” SPIE, Oct. 1995, pp. 1-10.
Oliver Brand, “CMOS-based MEMS/DTU PhD Course/Topics in Microelectronics”, Physical Electronics Laboratory, ETH Zurich, http://www.iqe.ethz.ch/pel, slides A-2 through A-36.
J.H. Smith et al., “Embedded Micromechanical Devices for the Monolithic Integration of MEMS with CMOS”, 1995 IEEE, pp. 609-612.
Bikram Baidaya et al., “Layout Verification and Correction of CMOS-MEMS Layouts”, Carnegle Mellon University, Pittsburgh.
Jeffrey D. Zahn et al., A Direct Plasma Etch Approach to High Aspect Ratio Polymer Micromachining With Applications in Biomems and CMOS-MEMS, 2002 IEEE, pp. 137-140.
Jim Hunter et al., “CMOS friendly MEMS manufacturing process”, 1998 IEEE, pp. 103-104.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

MEMS device and method of forming MEMS device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with MEMS device and method of forming MEMS device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and MEMS device and method of forming MEMS device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3377631

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.