Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2011-07-12
2011-07-12
Mullins, Burton (Department: 2834)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
C310S309000
Reexamination Certificate
active
07977207
ABSTRACT:
A microelectromechanical systems (MEMS) device includes a frame, an actuator formed on the same layer as the frame and connected to the frame to be capable of performing a relative motion with respect to the frame, and at least one stopper restricting a displacement of the actuator in a direction along the height of the actuator. The MEMS device is fabricated by bonding a second substrate to a first substrate, forming the frame and the actuator by partially removing the first substrate, and forming the at least one stopper by partially removing the second substrate.
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Communication dated Jan. 19, 2011 in counterpart European Patent Application 07120483.8.
Chang Seok-mo
Cho Jin-woo
Jeong Hee-moon
Kim Jun-o
Park Yong-hwa
Mullins Burton
Samsung Electro Mechanics Co., LTD
Sughrue & Mion, PLLC
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