MEMS device and fabrication method of the same

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates

Reexamination Certificate

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C310S309000

Reexamination Certificate

active

07977207

ABSTRACT:
A microelectromechanical systems (MEMS) device includes a frame, an actuator formed on the same layer as the frame and connected to the frame to be capable of performing a relative motion with respect to the frame, and at least one stopper restricting a displacement of the actuator in a direction along the height of the actuator. The MEMS device is fabricated by bonding a second substrate to a first substrate, forming the frame and the actuator by partially removing the first substrate, and forming the at least one stopper by partially removing the second substrate.

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Communication dated Jan. 19, 2011 in counterpart European Patent Application 07120483.8.

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