Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2006-09-12
2009-12-08
Nguyen, Khanh (Department: 1791)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C427S098400, C427S009000
Reexamination Certificate
active
07628875
ABSTRACT:
A method of bonding a MEMS device to a substrate to form a MEMS device assembly. A thickness profile of the MEMS device and/or the flatness of the mating surface of the substrate is determined. An adhesive is deposited onto a mating surface of the MEMS device and/or the mating surface of the substrate. The mating surfaces of the MEMS device and substrate are brought together, such that the adhesive can bond the MEMS device to the substrate. The volume of adhesive deposited at particular locations on the mating surface is varied to compensate for local variations in the thickness profile of the MEMS device and/or the flatness of the mating surface of the substrate.
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Bex Jan
Knaapen Raymond Jacobus
Kums Gerard
Nijsse Gerard Johannes Pieter
ASML Netherlands B.V.
Blades John
Nguyen Khanh
Sterne, Kessler, Goldstein & Fox P.L.L.C
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