Refrigeration – Structural installation – With electrical component cooling
Reexamination Certificate
2006-08-26
2010-11-02
Jules, Frantz F. (Department: 3744)
Refrigeration
Structural installation
With electrical component cooling
C062S185000, C062S201000, C361S699000, C165S080400, C165S120000
Reexamination Certificate
active
07823403
ABSTRACT:
A preferred embodiment of the MEMS cooling device of the invention comprises one or more MEMS micro-channel volumes in communication with one or more MEMS micro-pump assemblies wherein each micro-pump assembly comprises a flexure valve, such as a leaf valve and means to drive a coolant through the channel volumes such as an electrostatic interleaved comb drive structure. A preferred embodiment comprises an inlet micro-pump assembly and an outlet micro-pump assembly but the device may also be fabricated with a single pump mechanism per channel volume.
REFERENCES:
patent: 3573514 (1971-04-01), Race
patent: 4487340 (1984-12-01), Shaffer
patent: 5362213 (1994-11-01), Komatsu et al.
patent: 5901037 (1999-05-01), Hamilton et al.
patent: 5955668 (1999-09-01), Hsu
patent: 6089089 (2000-07-01), Hsu
patent: 6487864 (2002-12-01), Platt et al.
patent: 6578420 (2003-06-01), Hsu
patent: 6598409 (2003-07-01), Shyy et al.
patent: 6715352 (2004-04-01), Tracy
patent: 6892802 (2005-05-01), Kelly et al.
patent: 7084004 (2006-08-01), Vaiyapuri et al.
patent: 2004/0042937 (2004-03-01), Bentsen et al.
patent: 2005/0144968 (2005-07-01), Shakespeare
patent: 2006/0245933 (2006-11-01), Balch et al.
Crystal Structures of Electrospun PVDF Membranes and its Separator Application for Rechargeable Lithium Metal Cells by Kun Gao et al. from Materials Science and Engineering B 131 (2006) pp. 100-105.
Harris, Chad, et al., Fabrication, Modeling, and Testing of Micro-Cross-Flow Heat Exchangers, Journal of Microelectromechanical Systems, vol. 11, No. 6, Dec. 2002, USA.
International Search Report for PCT/US2006/039915 mailed Sep. 14, 2007.
Comings Daniel C
Jules Frantz F.
LandOfFree
MEMS cooling device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with MEMS cooling device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and MEMS cooling device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4160343