Memory systems with memory chips down and up

Details Memory systems with memory chips down and up Memory systems with memory chips down and up

2011-08-02

2011-08-02

Dinh, Tuan T (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S764000, C361S783000, C361S778000

Reexamination Certificate

active

07990737

ABSTRACT:
In some embodiments, a system includes a memory controller chip, memory chips on a first substrate, and a module connector. A first group of conductors is included to provide read data signals from at least some of the memory chips to the memory controller chip, and a second group of conductors to provide read data signals from the connector to the memory controller chip. The module connector may receive a continuity card or memory module. Other embodiments are described.

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Office Action Received for Chinese Patent Application No. 200680041302.7, mailed on Apr. 8, 2011, 4 pages of Office Action and 5 pages of English translation and pending claims.

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