Memory stack with an integrated interconnect and mounting struct

Details Memory stack with an integrated interconnect and mounting struct Memory stack with an integrated interconnect and mounting struct

1994-06-01

1995-09-05

Nelms, David C.

Static information storage and retrieval

Hardware for storage elements

365 63, 257686, 361749, 439 77, G11C 504, G06K 1907

Patent

active

054485118

ABSTRACT:
A memory stack includes a flexible interconnect device having a plurality of rigid sections connected together by a plurality of flexible sections. Memory devices such as dice or chips are mounted on the flexible interconnect structure and the structure is folded to at the flexible sections to form a stack. Connections among memory device I/Os and interconnect device mounting contacts are made via traces in a signal layer. A thermal conduction layer can be added to increase heat conduction away from the memory devices.

REFERENCES:
patent: 3766439 (1973-10-01), Isaacson
patent: 5117282 (1992-05-01), Salatino
patent: 5313416 (1994-05-01), Kimura
patent: 5335145 (1994-08-01), Kusui

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