Memory package with a controller on one side of a printed...

Details Memory package with a controller on one side of a printed... Memory package with a controller on one side of a printed...

2002-03-28

2003-10-28

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S723000, C257S724000, C257S777000, C257S679000, C365S052000

Reexamination Certificate

active

06639309

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to semiconductor memory chip packaging, and in particular to stacked multiple memory chip packages.
2. Discussion of the Related Art
Due to size limitations of printed circuit boards (PCB), only a finite number of packaged chips can be placed on a PCB. As the complexity of applications increases, a greater number of chips are needed on the PCB to implement the necessary functions, which would require larger size PCBs. However, it is also desirable to decrease the size of PCBs and devices containing PCBs. One method of achieving both these objectives is to increase the number of chips in a package, such as by stacking the chips, without increasing the planar area of the package. Stacking the chips can result in a smaller overall package footprint. However, stacking the chips directly on top of each other has its own drawbacks. When a chip is stacked upon a base chip, the base chip can be damaged in the process. Many different types of damage can occur including damage to the leads. Furthermore, while the footprint may be reduced, the height or aspect ratio is increased with the stacked chips.
SUMMARY OF THE INVENTION
Therefore, a need has arisen for a semiconductor chip package and packaging method that meets these challenges. One aspect of the invention is a memory package with a controller die on one side of a printed circuit board and a memory die on another side. Another aspect involves integrating the memory package into a memory card with optional additional memory. Yet another aspect is a microprocessor controlled device integrating the memory package with the controller die on one side of a printed circuit board and a memory die on the other side.


REFERENCES:
patent: 5070032 (1991-12-01), Yuan et al.
patent: 5095344 (1992-03-01), Harari
patent: 5168465 (1992-12-01), Harari
patent: 5198380 (1993-03-01), Harari
patent: 5268318 (1993-12-01), Harari
patent: 5268319 (1993-12-01), Harari
patent: 5313421 (1994-05-01), Guterman et al.
patent: 5343063 (1994-08-01), Yuan et al.
patent: 5380672 (1995-01-01), Yuan et al.
patent: 5512505 (1996-04-01), Yuan et al.
patent: 5534456 (1996-07-01), Yuan et al.
patent: 5554553 (1996-09-01), Harari
patent: 5579259 (1996-11-01), Samachisa et al.
patent: 5595924 (1997-01-01), Yuan et al.
patent: 5654217 (1997-08-01), Yuan et al.
patent: 5661053 (1997-08-01), Yuan
patent: 5663901 (1997-09-01), Wallace et al.
patent: 5677872 (1997-10-01), Samachisa et al.
patent: 5703395 (1997-12-01), Berney
patent: 5712179 (1998-01-01), Yuan
patent: 5747359 (1998-05-01), Yuan et al.
patent: 5756385 (1998-05-01), Yuan et al.
patent: 5786988 (1998-07-01), Harari
patent: 5847425 (1998-12-01), Yuan et al.
patent: 5867429 (1999-02-01), Chen et al.
patent: 5883409 (1999-03-01), Guterman et al.
patent: 5965913 (1999-10-01), Yuan et al.
patent: 6028336 (2000-02-01), Yuan
patent: 6040622 (2000-03-01), Wallace
patent: 6046935 (2000-04-01), Takeuchi et al.
patent: 6081447 (2000-06-01), Lofgren et al.
patent: 6103573 (2000-08-01), Harari et al.
patent: 6151248 (2000-11-01), Harari et al.
patent: 6208545 (2001-03-01), Leedy
patent: 6222265 (2001-04-01), Akram et al.
patent: 6426893 (2002-07-01), Conley et al.
U.S. patent application Ser. No. 09/667,344, Yuan et al., filed Sep. 22, 2000.

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