Memory package

Details Memory package Memory package

2006-01-25

2008-09-30

Tran, Long K (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S768000, C257S723000, C257S724000, C257S777000, C257SE25023, C438S106000, C438S108000

Reexamination Certificate

active

07429781

ABSTRACT:
A memory chip package with a controller die on a first side of a printed circuit board and a memory die on a second side of the same printed circuit board. The memory chip package is integrated into a microprocessor controlled device or alternatively is integrated into a portable memory card.

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The Patent Office of the People's Republic of China, Notification of the First Office Action for corresponding Chinese Patent Application No. 03108381.1, dated May 26, 2006, 5 pages.

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